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DATA SHEET
PC8106TB, PC8109TB
SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES
BIPOLAR ANALOG INTEGRATED CIRCUITS
DESCRIPTION
The PC8106TB and PC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The PC8106TB features improved intermodulation and PC8109TB features low current consumption. From these two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size. The PC8106TB and PC8109TB are manufactured using NEC's 20 GHz fT NESATTMIII silicon bipolar process. This process uses a silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* Recommended operating frequency : fRFout = 0.4 GHz to 2.0 GHz, fIFin = 100 MHz to 400 MHz * Supply voltage * High-density surface mounting * Low current consumption * Minimized carrier leakage * Built-in power save function : VCC = 2.7 to 5.5 V : 6-pin super minimold package : ICC = 9 mA TYP. @ PC8106TB ICC = 5 mA TYP. @ PC8109TB : Due to double balanced mixer
APPLICATION
* Cellular/cordless telephone up to 2.0 GHz MAX (example: PHS, PDC, DCS1800 and so on)
ORDERING INFORMATION
Part Number Markings C2D C2G Product Type High IP3 Low current consumption Package 6-pin super minimold Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face to tape perforation side. QTY 3 kp/Reel.
PC8106TB-E3 PC8109TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC8106TB, PC8109TB) Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12770EJ2V0DS00 (2nd edition) Date Published April 1999 N CP(K) Printed in Japan
(c)
1997, 1999
PC8106TB, PC8109TB
PIN CONNECTIONS
(Top view) (Bottom view)
Pin No. 1
3 2 1
Pin Name IFinput GND LOinput PS VCC RFoutput
3 2 1
C2D
4 5 6
4 5 6
2 3 4 5 6
Marking is an example of PC8106TB.
SERIES PRODUCTS (TA = +25 C, VCC = VPS = VRFout = 3.0 V, ZL = ZS = 50 )
ICC (mA) 9 5 16.5 CG1 (dB) 9 6 9 CG2 (dB) 7 4 5.5 PO(sat)1 (dBm) -2 -5.5 0.5 PO(sat)2 (dBm) -4 -7.5 -2 OIP31 (dBm) +5.5 +1.5 +9.5 OIP32 (dBm) +2.0 -1.0 +6
TYPE High IP3 Low power consumption Higher IP3
PRODUCT NAME
VCC (V) 2.7 to 5.5 2.7 to 5.5 2.7 to 3.3
PC8106TB PC8109TB PC8163TB
Caution The above table lists the typical performance of each model. See ELECTRICAL CHARACTERISTICS for the test conditions.
BLOCK DIAGRAM (FOR THE PC8106TB AND PC8109TB)
(Top view) LO input GND IF input PS VCC RF output
2
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEMS)
PHS, DECT
DEMO. I Q
RX
VCO SW
/N
PLL PLL
I 0 TX PA
PC8106TB
Phase shifter 90 Q
Analog cellular telephone
FM RX DEMO.
VCO SW
/N
PLL
PLL
TX
PA
MOD.
PC8109TB
Data Sheet P12770EJ2V0DS00
3
PC8106TB, PC8109TB
PIN FUNCTIONS (FOR THE PC8106TB AND PC8109TB)
Applied Voltage (V) - Pin Voltage Note (V) 1.3
Pin No. 1
Pin Name IFinput
Function and Explanation
Equivalent Circuit
This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. Local input pin. Recommendable input level is -10 to 0 dBm. Supply voltage pin. This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. Power save control pin. Bias controls operation as follows. Pin bias VCC GND Control Operation Power Save
5 6 3
2
GND
0
-
1
3
LOinput
-
2.4 - -
2
5 6
VCC
2.7 to 5.5
RFoutput Same bias as VCC through external inductor PS VCC/GND
4
-
VCC
5
4
GND
2
Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V.
4
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Votage PS pin Input Voltage Power Dissipation of Package Symbol VCC VPS PD Test Conditions TA = +25 C, Pin 5 and 6 TA = +25 C Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB TA = +85 C Rating 6.0 6.0 200 Unit V V mW
Operating Ambient Temperature Storage Temperature Maximum Input Power
TA Tstg Pin
-40 to +85 -55 to +150 +10
C C dBm
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Symbol VCC MIN. 2.7 -40 -10 0.4 100 TYP. 3.0 MAX. 5.5 Unit V Note The same voltage should be supplied to pin 5 and 6
Operating Ambient Temperature Local Input Level RF Output Frequency IF Input Frequency
TA PLOin fRFout fIFin
+25 -5 - -
+85 0 2.0 400
C dBm GHz MHz ZS = 50 (without matching) With external matching circuit
ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS 2.7 V unless otherwise specified)
PC8106TB
Parameter Circuit Current Circuit Current in Powersave Mode Conversion Gain 1 Conversion Gain 2 Maximum RF Output Power 1 Maximum RF Output Power 2 Symbol ICC ICC(PS) No signal VPS = 0 V fRFout = 0.9 GHz, PIFin = -30 dBm fRFout = 1.9 GHz, PIFin = -30 dBm fRFout = 0.9 GHz, PIFin = 0 dBm fRFout = 1.9 GHz, PIFin = 0 dBm Conditions MIN. 4.5 - TYP. 9 - MAX. 13.5 10 MIN. 2.5 - TYP. 5 - MAX. 8.0 10 mA
PC8109TB
Unit
A
dB dB dBm dBm
CG1 CG2 PO(sat)1 PO(sat)2
6 4 -4 -6.5
9 7 -2 -4
12 10 - -
3 1 -7.5 -10
6 4 -5.5 -7.5
9 7 - -
Data Sheet P12770EJ2V0DS00
5
PC8106TB, PC8109TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25 C, VCC = VRFout = 3.0 V, PLOin = -5 dBm, and VPS 2.7 V unless otherwise mentioned)
Reference Value Parameter Output Third-Order Distortion Intercept Point Third-Order Intermodulation Distortion 1 Third-Order Intermodulation Distortion 2 SSB Noise Figure Power Save Response Time Rise time Fall time Symbol OIP31 OIP32 IM31 Conditions fIFin1 = 240.0 MHz fIFin2 = 240.4 MHz fIFint = 240.0 MHz fIFin2 = 240.4 MHz PIFin = -20 dBm fRFout = 0.9 GHz fRFout = 1.9 GHz fRFout = 0.9 GHz
PC8106TB PC8109TB
+5.5 +2.0 -31 -30 +1.5 -1.0 -29 -28
Unit dBm
dBc
IM32
fRFout = 1.9 GHz
dBc
SSBNF TPS(rise) TPS(fall)
fRFout = 0.9 GHz, fIFin = 240 MHz VPS: GND VCC VPS: VCC GND
8.5 2.0 2.0
8.5 2.0 2.0
dB
s s
APPLICATION CIRCUIT EXAMPLE CHARACTERSISTICS FOR REFERENCE PURPOSE ONLY (TA = +25 C, VCC = VPS = VRFout = 3.0 V, fIFin = 130 MHz, fLOin = 1630 MHz, PLOin = -5 dBm)
Reference Value Parameter Conversion Gain Symbol CG Conditions fRFout = 1.5 GHz, with application circuit example fRFout = 1.5 GHz, with application circuit example
PC8106TB
7 -3.5
Unit dB
Maximum RF Output Power
PO(sat)
dBm
6
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
TEST CIRCUIT 1 (RF = 900 MHz, for the PC8106TB and PC8109TB)
RF = 900 MHz, matched Spectrum Analyzer 50 C4 10 000 pF VCC 1 000 pF 1 000 pF 1 pF C6 C5 L
6.8 nH 5
Signal Generator 6 RFoutput VCC PS IFinput GND LOinput 1 2 100 pF C1 Signal Generator 3 100 pF C2 PLoin = -5 dBm 50 50
C3
*
4
* In case of unstable operation, please connect capacitor 100 pF between 4 pin and 5 pin and adjust the matching circuit.
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
RFOUT
RF Connector 1 000 pF C6 C3 1 pF C5 6.8 nH 1 000 pF L
IFIN
100 pF C1
1
1 000 pF
P/S
100 pF
PC8106TB
C2
LOIN
C4 10 000 pF
Data Sheet P12770EJ2V0DS00
7
PC8106TB, PC8109TB
COMPONENT LIST
Form Chip capacitor Symbol C1, C2 C3, C6 C5 Through capacitor Chip inductor C4 L Value 100 pF 1 000 pF 1 pF 10 000 pF 6.8 nH
Note
Note 6.8 nH: Murata Mfg. Co., Ltd. Notes on the board
LQP31A6N8J04
1. 35 x 42 x 0.4 mm polyimide board, 35 m double-sided copper clad 2. Ground pattern on rear of the board 3. Solder plated patterns 4. : Through holes 5. C6 is for RF short on the board pattern
8
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
TEST CIRCUIT 2 (RF = 1.9 GHz, for the PC8106TB and PC8109TB)
RF = 1.9 GHz, matched Spectrum Analyzer 50 C4 10 000 pF VCC C3 1 000 pF 1 000 pF C6 Strip line
2.5 pF
Signal Generator 6 L
100 nH 5
RFoutput VCC PS
IFinput GND LOinput
1 2
100 pF C1
50
C5
Signal Generator 3 100 pF C2 PLoin = -5 dBm 50
*
4
* In case of unstable operation, please connect capacitor 100 pF between 4 pin and 5 pin and adjust the matching circuit.
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
RFOUT
RF Connector C3 2 pF C6 1 000 pF
C5 0.5 pF
IFIN
100 pF C1
1 000 pF 100 nH
1
1 000 pF
P/S
100 pF
PC8106TB
C2
LOIN
C4 10 000 pF
Data Sheet P12770EJ2V0DS00
9
PC8106TB, PC8109TB
COMPONENT LIST
Form Chip capacitor Symbol C1, C2 C3, C6 C5 Through capacitor Chip inductor C4 L Value 100 pF 1 000 pF 2.5 pF (2.0 pF, 0.5 pF parallel) 10 000 pF 100 nH
Note
Note 100 nH: Murata Mfg. Co., Ltd. Notes on the board
LQN1AR10J(K)04
1. 35 x 42 x 0.4 mm polyimide board, 35 m double-sided copper clad 2. Ground pattern on rear of the board 3. Solder plated patterns 4. : Through holes
10
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
APPLICATION CIRCUIT EXAMPLE (RF = 1.5 GHz, for the PC8106TB and PC8109TB)
RF = 1.5 GHz, matched Spectrum Analyzer 50 C4 10 000 pF VCC C3 1 000 pF 6 pF C6 2.7 nH L2
3.5 pF
Signal Generator 6 RFoutput VCC PS IFinput GND LOinput 1 2 100 pF C1 Signal Generator 3 100 pF C2 PLoin = -5 dBm 50 50
L1
150 nH 5
C5
*
4
* In case of unstable operation, please connect capacitor 100 pF between 4 pin and 5 pin and adjust the matching circuit.
EXAMPLE OF APPLICATION CIRCUIT ASSEMBLED ON EVALUATION BOARD
RFOUT
RF Connector C3 3 pF C6 6 pF
C5 L2 0.5 pF 2.7 nH
IFIN
100 pF C1
1 000 pF 150 nH
L1
1
1 000 pF
P/S
100 pF
PC8106TB
C2
LOIN
C4 10 000 pF
Data Sheet P12770EJ2V0DS00
11
PC8106TB, PC8109TB
COMPONENT LIST
Form Chip capacitor Symbol C1, C2 C3 C5 C6 Through capacitor Chip inductor C4 L1 L2 Value 100 pF 1 000 pF 3.5 pF (3.0 pF, 0.5 pF parallel) 6 pF 10 000 pF 150 nH 2.7 nH
Note 1
Note 2
Notes 1. 150 nH: TOKO Co., Ltd. 2. 2.7 nH : TOKO Co., Ltd. Notes on the board
LL2012-FR15 LL2012-F2N7S
1. 35 x 42 x 0.4 mm polyimide board, 35 m double-sided copper clad 2. Ground pattern on rear of the board 3. Solder plated patterns 4. NOTICE The test circuits and board pattern on data sheet are for performance evaluation use only. desired frequency in accordance to actual mounting pattern. For external circuits of the ICs, following Application Note is also available. * PC8106, PC8109 Application Note (Document No. P13683E) (They are not recommended circuits.) In the case of actual design-in, matching circuit should be determined using S parameter of : Through holes
12
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
TYPICAL CHARACTERISTICS (TA = +25C, VCC = VRFout) with TEST CIRCUIT 1 or 2, according to the operating frequency, unless otherwise specified
CIRCUIT CURRENT vs. SUPPLY VOLTAGE ( PC8106TB) 14 12 Circuit Current ICC (mA) 10 8 6 4 2 0 0 1 2 3 4 5 No signal VCC = VPS 6 7 8 Circuit Current ICC (mA) 8 10 CIRCUIT CURRENT vs. SUPPLY VOLTAGE ( PC8109TB)
6
4
2 No signal VCC = VPS 0 0 1 2 3 4 5 6 7 8
Supply Voltage VCC (V) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE ( PC8106TB) 12 VCC = 5.5 V 10 Circuit Current ICC (mA) 8 6 4 2 0 0 VCC = 3.0 V Circuit Current ICC (mA) 8 10
Supply Voltage VCC (V) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE ( PC8109TB)
VCC = 5.5 V 6
4
VCC = 3.0 V
2 0 0
1
2
3
4
5
6
1
2
3
4
5
6
PS Pin Input Voltage VPS (V)
PS Pin Input Voltage VPS (V)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE ( PC8106TB) 16 14 Circuit Current ICC (mA) 12 10 8 6 4 2 0 -60 -40 -20 0 20 VCC = VPS = 3.0 V No signal 40 60 80 100 Circuit Current ICC (mA)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE ( PC8109TB) 10
8
6 4
2 VCC = VPS = 3.0 V 0 -60 -40 -20 No signal 0 20 40 60 80 100
Operating Ambient Temperature TA (C)
Operating Ambient Temperature TA (C)
Data Sheet P12770EJ2V0DS00
13
PC8106TB, PC8109TB
S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3.0 V) - PC8106TB, PC8109TB in common - (THE parameters are monitored at DUT pins.)
LO port S11 Z REF 1.0 Units 2 200.0 mUnits/ 21.201 -53.748 hp RF port S22 Z REF 1.0 Units 2 200.0 mUnits/ 26.961 -87.312 hp
MARKER 1 1.15 GHz MARKER 2 1.65 GHz
MARKER 1 900 MHz MARKER 2 1.9 GHz
2 1
2
1
START
0.4 GHz
STOP
1.9 GHz
START
0.4 GHz
STOP
1.9 GHz
IF port
MARKER 1 240 MHz
S11 Z REF 1.0 Units 1 200.0 mUnits/ 194.16 -579.53 hp
1
START
0.1 GHz
STOP
0.4 GHz
14
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) - with TEST CIRCUITS 1 and 2 (PC8106TB, PC8109TB in common) - (S22 data are monitored at RF connector on board.)
900 MHz (LC-matched) in test circuit 1 log MAG S22 REF 0.0 dB 1 10.0 dB/ -19.567 dB hp 1.9 GHz (matched) in test circuit 2 log MAG S22 REF 0.0 dB 1 10.0 dB/ -15.213 dB hp
MARKER 1 900 MHz
MARKER 1 1.9 GHz
1
1 1
START 100 MHz
STOP 3 000 MHz
START 100 MHz
STOP 3 000 MHz
S22 REF 1.0 Units 1 200.0 mUnits/ 36.59 2.9355 hp
S22 REF 1.0 Units 1 200.0 mUnits/ 58.191 -4.1191 hp
MARKER 1 900 MHz 1 1
MARKER 1 1.9 GHz
START 100 MHz
STOP
3 000 MHz
START
100 MHz
STOP
3 000 MHz
Data Sheet P12770EJ2V0DS00
15
PC8106TB, PC8109TB
S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) - with application circuit example - (S22 data are monitored at RF connector on board.)
1.5 GHz (matched) in application circuit example log MAG S22 REF 0.0 dB 1 10.0 dB/ -20.901 dB hp C D MARKER 1 1.5 GHz
1
START 1.0 GHz
STOP 2.0 GHz
S22 Z REF 1.0 Units 1 200.0 mUnits/ 59.086 -3.873 hp C D MARKER 1 1.5 GHz 1
START 1.0 GHz
STOP
2.0 GHz
16
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
CONVERSION GAIN vs. SUPPLY VOLTAGE ( PC8106TB) 12 11 10 8 fRFout = 900 MHz 6 CONVERSION GAIN vs. SUPPLY VOLTAGE ( PC8109TB)
Conversion Gain CG (dB)
10 fRFout = 900 MHz 9 8 7 6 5 VCC = VPS 4 2 3 4 5 6 fRFout = 1.9 GHz
Conversion Gain CG (dB)
4 fRFout = 1.9 GHz 2 VCC = VPS 0 2 3 4 5 6
Supply Voltage VCC (V)
Supply Voltage VCC (V)
Conversion Gain CG (dB)
9 6
Conversion Gain CG (dB)
CONVERSION GAIN vs. LOCAL INPUT LEVEL ( PC8106TB) 15 fRFout = 900 MHz fLOin = 1140 MHz 12 VCC = VPS = 3.0 V
CONVERSION GAIN vs. LOCAL INPUT LEVEL ( PC8109TB) 15 fRFout = 900 MHz fLOin = 1140 MHz 12 VCC = VPS = 3.0 V
9 6
3
3
0 -25 -20 -15 -10
-5
0
5
10
15
0 -25 -20 -15 -10
-5
0
5
10
15
Local Input Level PLOin (dBm)
Local Input Level PLOin (dBm)
Conversion Gain CG (dB)
5 0
Conversion Gain CG (dB)
CONVERSION GAIN vs. LOCAL INPUT LEVEL ( PC8106TB) 15 fRFout = 1.9 GHz fLOin = 1.66 GHz 10 VCC = VPS = 3.0 V
CONVERSION GAIN vs. LOCAL INPUT LEVEL ( PC8109TB) 15 fRFout = 1.9 GHz fLOin = 1.66 GHz 10 VCC = VPS = 3.0 V 5 0
-5
-5
-10 -25 -20 -15 -10
-5
0
5
10
15
-10 -25 -20 -15 -10
-5
0
5
10
15
Local Input Level PLOin (dBm)
Local Input Level PLOin (dBm)
Data Sheet P12770EJ2V0DS00
17
PC8106TB, PC8109TB
RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm) RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8106TB) 10 0 -10 -20 Pout RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8109TB) 10 0 -10 Pout -20
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 900 MHz flFin1 = 240 MHz flFin2 = 240.4 MHz fLOin = 1440 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 900 MHz flFin1 = 240 MHz flFin2 = 240.4 MHz fLOin = 1440 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm)
0 -10 -20 Pout
RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm)
RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8106TB) 10
RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8109TB) 10 0 -10 Pout -20
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 1.9 GHz flFin1 = 240 MHz flFin2 = 240.4 MHz fLOin = 1660 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 1.9 GHz flFin1 = 240 MHz flFin2 = 240.4 MHz fLOin = 1660 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm)
RF Output Level of Each Tone PRFout (dBm) Third Order Intermodulation Distortion IM3 (dBm)
RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8106TB) 10 0 -10 -20 Pout
RF OUTPUT LEVEL AND IM3 vs. IF INPUT LEVEL ( PC8109TB) 10 0 -10 -20 Pout
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 1.5 GHz flFin1 = 130 MHz flFin2 = 130.4 MHz fLOin = 1630 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
-30 -40 -50 -60 -70 -80 -40 -30 -20 IM3 fRFout = 1.5 GHz flFin1 = 130 MHz flFin2 = 130.4 MHz fLOin = 1630 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 0 10
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
18
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY ( PC8106TB) 0 fRFout = 1.9 GHz PLOin = -5 dBm -10 VCC = VPS = 3.0 V -20 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY ( PC8106TB) 0 fRFout = 1.9 GHz PLOin = -5 dBm -10 VCC = VPS = 3.0 V -20 -30
-30
Local Leakage at RF Pin LOrf (dBm)
Local Leakage at IF Pin LOif (dBm)
-40
-40
-50 0
0.5
1
1.5
2
2.5
3
3.5
-50 0
0.5
1
1.5
2
2.5
3
3.5
Local Input Frequency fLOin (GHZ)
Local Input Frequency fLOin (GHZ)
IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY ( PC8106TB) 0 fRFout = 1.9 GHz fLOin = 1.66 GHz PLOin = -5 dBm fIFin = -30 dBm VCC = VPS = 3.0 V
IF Leakage at RF Pin IFrf (dBm)
-10 -20 -30
-40
-50 0
100
200
300
400
500
600
IF Input Frequency fIFin (MHZ)
Data Sheet P12770EJ2V0DS00
19
PC8106TB, PC8109TB
PACKAGE DIMENSIONS
6 pin super minimold (Unit: mm)
0.1 MIN.
0.2 +0.1 -0
0.15 +0.1 -0
1.25 0.1
2.1 0.1
0 to 0.1
0.65 1.3
0.65
0.7 0.9 0.1
2.0 0.2
20
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
NOTES ON CORRECT USE
(1) (2) (3) (4) (5) Observe precutions for handling because of electrostatic sensitive devices. Form a ground pattern wide as possible to minimize ground impedance (to prevent undesired oscillation). Keep the wiring length of the ground pins as short as possible. Connect a bypass capacitor to the VCC pin. Connect a matching circuit to the RF output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared Reflow
Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P12770EJ2V0DS00
21
PC8106TB, PC8109TB
[MEMO]
22
Data Sheet P12770EJ2V0DS00
PC8106TB, PC8109TB
[MEMO]
Data Sheet P12770EJ2V0DS00
23
PC8106TB, PC8109TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
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